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| Next Previous Silicon Protection Circuits TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC This family of avalanche diode arrays are designed for ESD protection and offered in an ultra small chip scale package. The multi-channel devices are used to help protect sensitive digital or analog input circuits on data, signal, or control lines with unipolar voltage levels up to 5VDC. The state-of-the-art structure is designed to suppress ESD and other transient over-voltage events to meet the International Electrotechnical Compatability (EMC transient immunity stantards IEC 61000-4-2 for Electrostatic Discharge Requirements). The monolithic silicon devices are comprised of specially designed structures for transient voltage suppression (TVS). The size and shape of these structures has been tailored for transient protection. The low capacitance and clamp voltage are ideal for high speed signal line protection. NEW Ordering Information PART NUMBER SP0504BACT SP0508BACT SP0516BACT DIODE CHANNELS BUMPS 4 8 16 6 10 20 CS PACKAGE SIZE (MM) 1.804 x 1.154 3.104 x 1.154 3.104 x 2.454 QUANTITY PER REEL 3500 3500 3500 5 Features * An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (.65mm bump pitch) * ESD Capability per HBM Standards - IEC 61000-4-2, Direct Discharge...............................25kV (Level 4) SILICON PROTECTION CIRCUITS NOTE: Bump pitch is 0.65mm Schematic SP0504BAC B1 B2 B3 SP0516BAC D1 D2 D3 D4 D5 - IEC 61000-4-2, Air Discharge....................................30kV (Level 4) - MIL STD 833D (Method 3015.7) ..............................................30kV * Signal line protection for applications up to 5VDC * Fast response time...........................................................................< 1ns * Low input capacitance ..........................................................39pF Typical * Low clamp voltage ..................................................................12V Typical A1 A2 A3 * Low input leakage.....................................................................10uA Max C1 C2 C3 C4 C5 * Operating temperature range ............................................- 40C to 85C B1 B2 B3 B4 B5 SP0508BAC R1 R2 R3 R4 R5 Applications * Cell phone handsets * Personal Digital Assistants (PDA) * Portable handheld equipment (Laptop, Palmtop computers) * Computer port, keyboard (USB1.1) A1 A2 A3 A4 A5 * Set-Top Box (Audio and Video Ports) * PCMCIA cards A1 A2 A3 A4 A5 w w w. l i t t e l f u s e . c o m 199 Next Previous Silicon Protection Circuits TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC ELECTRICAL SPECIFICATIONS TA = 25C Unless Otherwise Specified PARAMETER Reverse Standoff Voltage Reverse Standoff Leakage Current Signal Clamp Voltage Positive Negative Clamp Voltage during ESD MIL-STD-883D Method 3015 8kV Positive 8kV Negative ESD Test Level IEC-61000-4-2, Contact discharge MIL-STD-883D Method 3015 (HBM) Capacitance Turn on/off Time Temperature Range Operating Storage - 40 - 65 85 150 C C 2.5VDC @ 1Mhz 25 30 39 <1 kV kV pF ns 12 -8 V V I = 10mA I = 10mA 5.6 - 1.2 6.6 - 0.8 8.0 - 0.4 V V TEST CONDITIONS I = 10A V = 5.5V MIN 5.5 TYPICAL MAX 10 UNITS V A Typical Solder Reflow Thermal Profile (No Clean Flux) 250 EXH PH Z2 Z3 Z4 Z RF CD EXH PRINTED CIRCUIT BOARD RECOMMENDATIONS Pad Size on PCB Pad Shape Pad Definition 0.300mm Round Non-Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq) 50/50 No Clean OSP (Entek Cu Plus 106A) 225 200 Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 242 290 339 387 435 Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperature Opening Solder Flux Ratio Solder Paste Board Trace Finish Time (s) 200 w w w. l i t t e l f u s e . c o m Next Previous Silicon Protection Circuits TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC Outline Drawings SP0504BAC 3.104mm (.071") 0.65mm (.026") 0.252mm (.010") 0.65mm (.026") B A 0.35mm Diameter (.014") 1.154mm (.045") 1 2 3 0.252mm (.010") 0.381mm (.015") 0.643mm (.025") SP0508BAC 3.104mm (.122") 0.65mm (.026") 5 SILICON PROTECTION CIRCUITS 1.154mm (.045") 0.381mm (.015") 0.643mm (.025") 2.454mm (.096") 0.381mm (.015") 0.643mm (.025") 201 0.252mm (.010") 0.65mm (.026") B A 1 0.35mm Diameter Bumps (.014") 2 3 4 5 0.252mm (.010") SP0516BAC 3.104mm (.122") 0.252mm (.010") 0.65mm (.026") 0.65mm (.026") B A 1 0.35mm Diameter Bumps (.014") 2 3 4 5 0.252mm (.010") w w w. l i t t e l f u s e . c o m |
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